The MECHATROLINK Members Association general meeting was held at Mita NN Hall in Tokyo, on June 24, 2009. Despite the overcast weather, the turnout was larger than the previous year, with 97 participants from 55 companies.

The meeting started with a welcome speech by Hiroshi Ogasawara, the President of the Executive Committee of the MMA. Takeshi Tanaka, the General Secretary of the MMA, then reported on the results of FY 2008. This was followed by a FY 2008 financial report by the MMA Secretariat. Then the Marketing group reported on its activities, which consisted mainly of MECHATROLINK fairs, and outlined future MMA development plans. After a question-and-answer session, the general meeting concluded on a high note.

Lectures by two guest speakers followed the general meeting. The first speaker, Akira Sawamura from ULVAC Inc., gave a speech titled, "Performance and Challenges of Equipment for Ultra-Large Glass Substrates in One Drop Filling (ODF)." His clear presentation focused on topics that were of interest to MMA members.

The second guest speaker was Hisato Yoneda from MURATA MACHINERY, LTD. In his speech titled, "Simulations and Effective Use of OPC-FA Systems," he gave a detailed explanation focusing on semiconductor transport systems.

After the lectures, new products by MMA members were introduced, including many products compatible with MECHATROLINK-Ⅲ. Some products, including actual devices, were displayed at the rear of the hall.

Finally, the future plans for MECHATROLINK were announced, and a reception followed. The MMA will continue to promote activities involved in the pursuit of making MECHATROLINK a global standard network.